Description:
Past methods of applying interconnects in IC (integrated circuit) manufacturing have included chemical vapour deposition (CVD) and ion implantation. A new method in the industry uses low-k, spin-on dielectrics which allows for faster interconnection delays and higher throughput. This method is thought to be better than previous methods because during the spin-on process, a more uniform layer is applied. Also, no additional equipment is needed such as polishers. Therefore, the total cost is less and the equipment has a smaller footprint where floor space in a clean room is limited.

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